XDW282-Fully Automatic Wafer Temporary Debonder
| 4”-8”wafer application Thinner wafer capability Wafer cassette loading & unloading Automatic bonded wafer aligning Thermal debonding device wafer & support wafer Used bonding tape robot peeling Automatic wafer mounting Wafer intelligent mapping in cassette Built-in LED UV irradiating module (Optional) PC based control with Windows OS SECS/GEM or simple communication |
